Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY
Fully Compliant With JEDEC Standards And Equipment
Manufacturer Factory Direct Sale Full Scales ESD SMT Tray Electronic Packaging Tray 100% Original Injection Customized Moulding
Why choose Hiner-pack to design and produce ESD SMT electronic packaging trays for you?
1. Choosing the right supplier
Hiner-pack is a company specializing in electronic packaging and tray manufacturing, with 13 years of experience in the industry, rich experience in R&D and well-equipped production facilities.
Hiner-pack has 13 years of experience in R&D and production facilities, as well as ISO certification and a good reputation in the market to ensure the quality of its products.
2. Product specifications and customization
Full-size ESD trays: Confirm that the product size, material (e.g., antistatic polypropylene) and design meet your specific needs.
Custom molding: Hiner-pack offers customization services, including colors, logos and specific shape designs. Meet your branding and design needs.
3. Quality Assurance
100% Original Material: Ensure that 100% original injection molding materials are used for the trays to prevent inferior materials from affecting use.
Sample testing: We can provide different kinds of samples for testing at the same time to verify the anti-static performance and durability or other testing conditions.
4. Price and delivery lead time
Inquiry: We can design and process the molds, which has reduced some cost for customers. In addition, we have more than 10 years experience in pallet manufacturing, which ensures customers have no worries.
Delivery time: Confirm the production cycle and delivery time to ensure that your production schedule is met.
5. After-sales service
Customer support: If there is a quality problem, our factory support includes return and exchange, technical support and other services.
Long-term cooperation: Consider establishing a long-term relationship with Hiner-pack to make subsequent purchases more convenient.
| Mold No. |
HN23099 |
| Cavity Size/mm |
27.3*27.3*1.66 |
| Overall Size/mm |
322.6x135.9x12.19 |
| Matrix Quantity |
4X9=36PCS |
| Material |
MPPO/PPE |
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Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards Images
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