Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip
The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack provides a safe and convenient solution for packaging and transporting various microelectronic components such as Chip, Die, COG, and Optoelectronic devices. These products come in multiple sizes and materials, with options including 2-inch and 4-inch product specifications. Materials used include Antistatic/Conductive ABS and PC, offering flexibility for different needs. Additionally, customization is available to meet the specific requirements of customers.
Features:
Molded of ESD-safe, non-sloughing, carbon-powder-free, clean polymers
This product is manufactured using ESD-safe, non-sloughing, carbon-powder-free, clean polymers. These materials are carefully selected to ensure safety against electrostatic discharge (ESD) while also being environmentally friendly and free of carbon powder residue.
Carbon-fiber reinforced for strength and permanent ESD protection
In addition to its primary materials, this product is reinforced with carbon fiber for enhanced strength and long-lasting ESD protection. The carbon fiber reinforcement ensures durability and reliability in various applications where ESD protection is a critical requirement.
Up to 180°C bake temperature available
This product can withstand bake temperatures of up to 180°C, making it suitable for use in high-temperature environments. The ability to endure such heat levels demonstrates the product's resilience and adaptability for diverse manufacturing processes.
Industry-standard formats, customized for your needs
Available in industry-standard formats, this product can also be customized to meet specific requirements. Whether you need a standard size or a tailored design, the product offers flexibility to accommodate your unique needs and preferences.
Technical Parameters:
| HN24036 Technical Data Ref. |
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 19*12=228PCS | 2.70*1.30*1.40mm |
| Size | Length * Width * Height (according to customer's requirement) |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. The free samples: Choosen from existing products. |
| B. Customized samples as per your design/demand |
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format | PDF,2D,3D |
Specifications:
The variability is in the pocket size, geometry and count.
Waffle pack trays are usually specified by a few characteristics:
- External size – 2”, 4”, etc.
- Pocket size or pocket count – choosing one will dictate the other
- Temperature rating – the maximum temperature at which the tray will be used
Custom waffle pack trays require additional specification:
- Component geometry
- Special process requirements
- Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)
