2-inch Waffle Pack IC Chip Tray
Custom cavity waffle packs tailored to your chip size, thickness, and handling method—ideal for high-value devices.
High temperature tray is an IC tray, an IC tray is a semiconductor chip enterprise for its chips for packaging and baking test carrier. Because it can be used in a 120℃-220℃bake environment without deformation characteristics, the electronic waste industry commonly known as "high temperature plate"
Antistatic plastic trays can eliminate static electricity, a large number of electronic devices and products in the production process of turnover loading, packaging, storage, and transportation. The finished product has good mechanical strength and heat resistance, Good impact resistance, and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time, and temperature. It is mainly used in the electronics industry.
Advantages:
1. Lightweight, saving transportation and packaging costs;
2. Size specification, compatible with any 2 ", 3 ", or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensures that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design effectively prevents stacking error, and corrects the direction of placement.
Technical Parameters:
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
| Brand | Hiner-pack | Outline Line Size | 50.7*50.7*4mm |
| Model | HN2078 | Cavity Size | 4.83*3.94*0.65 mm |
| Package Type | Die | Matrix QTY | 10*8=80PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Application:
Semiconductor Wafer Die Wafer Bare, Electronic components, optical electronic components, etc.
FAQ:
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method can you help ship the goods?
A: By sea, by air, or by express, by mail, post, according to customer order quantity and volume.
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2-inch Waffle Pack IC Chip Tray Images
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